- Turnkey PCB Design
- 2019-10-25 06:56
- Laminates: FR4(TG130, TG150, TG170), High frequency, Halogen free, Aluminum baseLayers: 1-32Max Size: 800mm X 650mmMin.Board Thickness: 2L: 0.20mm, 4L: 0.40mm, 6L:0.60mm, 8L:0.80mm, 10L:1.20mmFinished Copper: Inner:12-175um Outer:35-350umMin.Line/Space: 3
- SMT PCB Layout
- 2019-09-30 18:12
- (1) Gerber data for all artwork layers(2) Aperture list or lists for all layers(3) Drill file in Gerber or Excellon format(4) Drawings: Print should be hard copy or Gerber HPGL or DXF format
- PCB Design Service
- 2019-09-08 09:45
- Surface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA/ uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under-filled CCGAB
- PCB Design and Assembly Service
- 2019-08-25 06:00
- Surface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA/ uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under-filled CCGAB
- PCB Produce and Assembly
- 2019-08-10 11:23
- CapabilitiesSurface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA / uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under